CARLSBAD, CA--(Marketwire - March 05, 2009) - Palomar Technologies announced today it will be launching its new Wafer Scale Die Attach System at the 2009 IMAPS International Conference and Exhibition on Device Packaging, to be held March 10-12 in Scottsdale, Arizona.
Palomar Technologies will be exhibiting in booth #15 at the IMAPS Conference. Palomar’s bonding experts will explain how their new high accuracy wafer scale die attach system presents the ideal and complete solution to today’s complex microelectronic packaging challenges.
Palomar Technologies’ Model 6500-Wafer Scale Packaging (WSP) Eutectic Die Bonder enables very high density packaging at wafer scale, using its proprietary Pulsed Heated tool positioned with 0.1 micron resolution. By carefully managing and monitoring heat delivered under constant cover gas, very-low-void eutectic die attach is obtained. The system can preheat wafers up to 250C. The eutectic process is then completed by placing the die and pulse heating the tool through a programmable temperature profile. Cooling gas can then be applied to increase overall system throughput. Special vision algorithms allow referencing of multiple features and then computing placement for optimal die alignment.
Palomar Technologies is a leading provider of automated precision microelectronic assembly equipment and contract assembly services that serves industry leaders in telecommunications, medical, defense and aerospace and commercial high-technology.
Palomar Technologies continues its legacy as experts in precision wire bond, gold wire bond and high accuracy component placement technology. New applications in 2009 include wafer scale packaging, chip-on-flex, advanced Gold ball and stitch bonding, gold stud bumping for GGI (Gold Gold Interconnect) as well as epoxy and eutectic solder and thermo-compression bonding processes.
For more information on Palomar’s Model 6500 WSP Eutectic Die Bonder, please visit www.PalomarTechnologies.com.
About Palomar Technologies:
Palomar Technologies (formerly part of Hughes Aircraft Company) is the world’s foremost supplier of automated high-precision wire bonders, die bonders and component placement systems combined with process development and contract assembly services to increase yield and lower costs for microelectronic device manufacturers.
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Technorati: microelectronics wire bonding die bonders eutectic die attach wafer scale packaging
