Integrated Sensing Systems, Inc. (ISSYS) announced today that it has won a Small Business Innovation Research contract from the National Science Foundation (NSF). The six-month project, entitled “Wafer-Scale, Hermetic, Packaging of MEMS-Based Systems” is aimed towards development of a novel packaging method which will greatly simplify the packaging of MEMS and their associated electronics. This simplification allows the commercialization of a variety of MEMS-based products that are currently not possible due to high cost of manufacturing or packaging problems. ISSYS’ method can be used for a wide variety of MEMS based devices, in particular, for applications where the MEMS device needs to be in direct contact with the media and the electronics need to be isolated from the environment.
