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HILLSBORO, Ore., July 17, 2013 (GLOBE NEWSWIRE) -- FEI (Nasdaq:FEIC) today introduced two new DualBeam systems that feature innovative detection suites that provide high-quality imaging and fast analysis over the broadest range of samples. The new Scios™ DualBeam™ is specifically positioned for fast two-dimensional (2D) and three-dimensional (3D) characterization. The Helios NanoLab™ 660 DualBeam adds capabilities for specialized applications, such as the fabrication of prototypes for nanometer-scale devices.
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