GARCHING, Germany--(BUSINESS WIRE)--SUSS MicroTec (FWB:SMH) (GER:SMH), supplier of innovative solutions for 3D Integration (3DI), MEMS, Advanced Packaging and Nanotechnology markets, launches the third generation of its MA/BA8, a manual mask and bond aligner that offers highest process flexibility including submicron alignment and exposure optics dedicated for thick resist exposure. In addition it allows easy and fast upgrades to emerging technologies such as UV-nano imprinting, microlens imprinting, UV-bonding and enhanced bond alignment. The new MA/BA8 Gen3 from SUSS MicroTec combines an unmatched resolution and light uniformity with a high-precision alignment capability down to 0.25 microns, the highest accuracy for a mask aligner available today.
