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HILLSBORO, Ore., Aug. 1, 2013 (GLOBE NEWSWIRE) -- FEI (Nasdaq:FEIC) today introduced three new systems that tailor the power of transmission electron microscopy (TEM) to specific application and industry needs. The new systems launched today provide efficient and effective application-specific workflows for semiconductor manufacturing and scientific research. They include the new Metrios™ TEM for advanced semiconductor manufacturing metrology, Talos™ TEM that provides high-speed imaging and analysis for materials and life sciences applications, and the Titan™ Themis™ TEM for enhanced atomic-scale measurements of material properties.
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HILLSBORO, Ore., Aug. 1, 2013 (GLOBE NEWSWIRE) -- FEI (Nasdaq:FEIC) today introduced three new systems that tailor the power of transmission electron microscopy (TEM) to specific application and industry needs. The new systems launched today provide efficient and effective application-specific workflows for semiconductor manufacturing and scientific research. They include the new Metrios™ TEM for advanced semiconductor manufacturing metrology, Talos™ TEM that provides high-speed imaging and analysis for materials and life sciences applications, and the Titan™ Themis™ TEM for enhanced atomic-scale measurements of material properties.
Help employers find you! Check out all the jobs and post your resume.
