PLAINSBORO, N.J., March 8, 2007 (PRIME NEWSWIRE) (PRIMEZONE) -- Integra LifeSciences Holdings Corporation (Nasdaq:IART) will showcase Integra Mozaik(TM) Osteoconductive Scaffold at the AANS Spine Section meeting in Phoenix, Arizona March 7-10, 2007. Integra Mozaik(TM) Osteoconductive Scaffold recently received 510K clearance from the Food and Drug Administration as a bone void filler. Mozaik(TM) Osteoconductive Scaffold is designed to bridge gaps or fill voids in the skeletal structures of the spine, extremities, and pelvis. Mozaik(TM) is available in two configurations, a compression resistant strip and a putty. The strip configuration is intended for procedures such as posterolateral lumbar fusion and interbody fusion. The putty is intended to fill voids and complex cavities.
