OSLO--(BUSINESS WIRE)--Thin Film Electronics ASA (“Thinfilm”) (OSE: THIN.OL), a leader in development of printed electronics, and Bemis Company, Inc (“Bemis”) (NYSE:BMS), a Fortune 500 supplier of flexible packaging and pressure sensitive materials, today announced an agreement to develop a flexible sensing platform for the packaging market. The result will be a new category of packaging that can collect and wirelessly communicate sensor information, for use by leading food, consumer products and healthcare companies worldwide.
