CARLSBAD, Calif.--(BUSINESS WIRE)--Asymtek, a Nordson company (Nasdaq:NDSN) and leader in dispensing, conformal coating, and jetting technologies, and the Fraunhofer Institut für Zuverlässigkeit und Mikrointegration (IZM) Berlin announce their ongoing collaborative effort to support microelectronics packaging and encapsulation research using Asymtek’s advanced dispensing and coating technology. Fraunhofer IZM recently installed Asymtek’s Axiom™ X-1020 high volume dispensing system in its Center for Applied Research, which focuses on interconnection technologies and microelectronics. The Axiom system, equipped with the award-winning DispenseJet® DJ-9000 valve, is being used for underfilling inter-chip gaps, wafer level underfilling for Chip-on-Wafer assemblies, and glob top jetting over wire bonds. “The Axiom system offers highly repeatable results that can be easily transferred from our lab to production,” stated Karl-Friedrich Becker, group manager, assembly and encapsulation for Fraunhofer Berlin.
