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HILLSBORO, Ore., June 6, 2013 (GLOBE NEWSWIRE) -- FEI (Nasdaq:FEIC) today released the Helios NanoLab™ 1200AT, the newest generation of its full-wafer DualBeam™ analysis systems. The addition of an optional automated FOUP (front opening universal pod) loader allows location of the Helios NanoLab 1200AT system inside the semiconductor wafer fab, where its scanning electron microscope (SEM) imaging and precise focused ion beam (FIB) milling are used by engineers to extract ultrathin samples of targeted structures and defects for examination in a high-resolution transmission electron microscope (TEM).
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HILLSBORO, Ore., June 6, 2013 (GLOBE NEWSWIRE) -- FEI (Nasdaq:FEIC) today released the Helios NanoLab™ 1200AT, the newest generation of its full-wafer DualBeam™ analysis systems. The addition of an optional automated FOUP (front opening universal pod) loader allows location of the Helios NanoLab 1200AT system inside the semiconductor wafer fab, where its scanning electron microscope (SEM) imaging and precise focused ion beam (FIB) milling are used by engineers to extract ultrathin samples of targeted structures and defects for examination in a high-resolution transmission electron microscope (TEM).
Help employers find you! Check out all the jobs and post your resume.
