Encision, Inc. Featured In NY Times’ Article

BOULDER, Colo., March 17 /PRNewswire-FirstCall/ -- Encision Inc. , a medical device company with patented surgical technology emerging as a standard of care in minimally-invasive surgery, announced that Encision and its patented AEM(R) technology were featured in today’s edition of The New York Times’ Business Day.

“We are pleased that Encision’s technology to reduce the risk of serious complications from stray energy burns during laparoscopy has received this level of publicity and awareness,” said Jack Serino, President & CEO of Encision.

Encision Inc. designs and manufactures innovative surgical devices that allow the surgeon to optimize technique and patient safety during a broad range of surgical procedures. Based in Boulder, Colorado, the Company pioneered the development of patented AEM(R) Laparoscopic Instruments to improve electrosurgery and reduce the chance for patient injury in minimally invasive surgery.

In accordance with the safe harbor provisions of the Private Securities Litigation Reform Act of 1995, the Company notes that statements in this press release and elsewhere that look forward in time, which include everything other than historical information, involve risks and uncertainties that may cause actual results to differ materially from those indicated by the forward-looking statements. Factors that could cause the Company’s actual results to differ materially include, among others, its ability to increase revenues through the Company’s distribution channels, insufficient quantity of new account conversions, insufficient cash to fund operations, scale up production to meet delivery obligations, delay in developing new products and receiving FDA approval for such new products and other factors discussed in the Company’s filings with the Securities and Exchange Commission.

CONTACT: Marcia McHaffie, Encision Inc., 303-444-2600, mmchaffie@encision.com

Encision Inc.

CONTACT: Marcia McHaffie of Encision Inc., +1-303-444-2600,mmchaffie@encision.com

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