LISLE, Ill.--(BUSINESS WIRE)--Molex Incorporated will feature MediSpec™ Molded Interconnect Device/Laser Direct Structuring (MID/LDS) in Booth 1518 at the Medical Design & Manufacturing (MD&M) Minneapolis Conference, October 29-30. Molex developed the innovative 3D technology, which combines advanced MID technology with LDS antenna expertise, to deliver integrated fine-pitch 3D circuitry in a single molded package suitable for high density medical devices meeting stringent medical grade guidelines.
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