HILLSBORO, Ore., July 13, 2009 (GLOBE NEWSWIRE) -- FEI Company (Nasdaq:FEIC), a leading provider of atomic-scale imaging and analysis systems, today announced the newest member of the Helios NanoLab(tm) Family -- the Helios 1200 Full Wafer DualBeam(tm) system. The ability of the Helios 1200 to analyze full wafers up to 300 mm improves the efficiency of semiconductor and data storage failure analysis and manufacturing support labs that need to deliver accurate data quickly to the production floor.
