Semiconductor Packaging Engineer II

Please be aware that, as a condition of employment, proof of COVID vaccination is required for all U.S.-based employees (subject to limited exceptions).  To ensure the health and safety of all PacBio employees and our prospective candidates, we have instituted a virtual interview and onboarding experience.

Packaging Engineer II

PacBio (NASDAQ: PACB) is a premier life science technology company that is designing, developing and manufacturing advanced sequencing solutions to help scientists and clinical research resolve genetically complex problems.  Our mission is to enable the promise of genomics to better human health. Genomics is core to all biological processes, and our advanced genomics tools provide scientists and clinical researchers the insights to better understand biology and health.  We are now entering the century of biology and genomics is at the heart of the next revolution.  Become part of the new paradigm in gene sequencing and help shape the future of genomic study by joining the PacBio team.

The Process Development Group seeks an experienced semiconductor packaging engineer with background in device assembly to support prototyping activities at PacBio.  The individual will be required to participate in complex and multifunctional development projects and develop assembly processes to enable the build of devices for internal programs. The projects will require both initiative and a desire to learn about topics and techniques outside of conventional packaging. The candidate will be expected to have experience with working in cleanroom conditions and will be responsible for supporting internal customers' programs, both through in-house assembly processes and through external vendors. The candidate will be comfortable interacting with and managing external vendors and with working in extended teams.

Responsibilities:         

• Collaborate with cross-functional groups including Manufacturing, NPI, Surface Chemistry and Semiconductor Design and Wafer Fabrication, to build prototype devices to the required specification and to develop assembly processes to support new assembly process flows.
• Work with external vendors to support key fabrication processes. This may involve visits and teleconferences with domestic and overseas partners.
• Maintain systems for scheduling internal build requests and tracking inventory of materials.
• Identify new materials and processes, prepare and execute DOEs and propose improvements.
• Collaborate with R&D teams and with vendors to analyze failures and determine root cause using such techniques as SEM, EDX, TEM and mechanical and reliability testing.

Position Requirements:         

• Bachelors or Advanced Degree or equivalent experience in Chemical Engineering, Materials Science, Mechanical Engineering, Physics or related scientific and engineering disciplines. At least 3 years of hands-on industry experience in semiconductor assembly techniques.
• Experience in cleanroom working and the operation of semiconductor package assembly equipment, such as die / wire bonding.
• Experience working with external vendors and OSATs.
• Proficient in CAD design tools such as SolidWorks or AutoCAD, and in statistical analysis tools such as JMP or Minitab.
• Experience with failure analysis, DOE, SPC, FMEA and DFM.
• Excellent presentation, verbal and written communication skills.

All listed tasks and responsibilities are deemed as essential functions to this position; however, business conditions may require reasonable accommodations for additional tasks and responsibilities. 

All qualified applicants will receive consideration for employment without regard to race, sex, color, religion, national origin, protected veteran status, or on the basis of disability, gender identity, and sexual orientation. 

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