Director, Package Design and Assembly Development

Employer
PacBio
Location
Menlo Park, CA
Posted
May 18, 2022
Ref
2642
Hotbed
Biotech Bay
Required Education
Bachelors Degree
Position Type
Contract

Please be aware that, as a condition of employment, proof of COVID vaccination is required for all U.S.-based employees (subject to limited exceptions).  To ensure the health and safety of all PacBio employees and our prospective candidates, we have instituted a virtual interview and onboarding experience.

Director, Package Design and Assembly Development

Position is preferably based in Menlo Park with an expectation to lead teams at both our San Diego, CA and Menlo Park, CA locations.

PacBio (NASDAQ: PACB) is a premier life science technology company that is designing, developing and manufacturing advanced sequencing solutions to help scientists and clinical research resolve genetically complex problems.  Our mission is to enable the promise of genomics to better human health. Genomics is core to all biological processes, and our advanced genomics tools provide scientists and clinical researchers the insights to better understand biology and health.  We are now entering the century of biology and genomics is at the heart of the next revolution.  Become part of the new paradigm in gene sequencing and help shape the future of genomic study by joining the PacBio team.

Pacific Biosciences is seeking a talented, driven and experienced individual to lead the SMRT Cell Packaging team working on current and next generation devices. The candidate needs to have a passion for Pacific Biosciences technology and mission. They will lead inhouse package design, assembly process development, technical supplier engagement and coordination with cross functional departments. The Director will work closely with development teams, supply chain, program management, finance, and other key stakeholders to successfully launch products. The candidate will be required to lead and/or participate in complex projects ranging in product development from ideation of concepts, creating feasibility plans, developing new designs and processes, solving yield issues, managing and preventing excursions and qualifying processes for a full product release. The candidate must be comfortable in a multi-disciplinary environment.

Responsibilities:

  • Lead the Package Development team to introduce new DNA sequencing products from concept to production ramp in our in-house Manufacturing, CMs (Contract Manufacturers) and Suppliers across the globe, in hybrid and fully outsourced models.
  • Manage and coordinate Package design and development activities between all functional groups including Engineering, Chemistry, Optical Design, Fab Process Development, Flow Cell Development, Supply Chain Management, Quality and Operations.
  • Attract, develop, and retain an engaged Packaging Team.
  • Work with the team and other functional groups to identify, prioritize, and act on meeting project timelines and risk management
  • Define SOWs and RFQs for development projects ranging from package design, assembly unit process development and package component fabrication, such as ceramics, injection molded plastics etc.
  • Lead and support budgeting, feasibility studies and estimates, quotes for development activities, purchasing capital equipment and tooling for new programs or modifications to existing programs
  • Work closely with internal teams and manufacturing partners for product development, qualification, verification and validation activities to support smooth product launches, as well as technology roadmaps to support ongoing product innovation initiatives
  • Develop solutions and execute to a technical plan to achieve yield improvements and COGS targets for the integrated process flow. 
  • Deliver project status reviews to PMO, senior management and peers


Position Requirements:        

  • 5+ years of experience in a management role and coordinating complex, cross-functional projects
  • 10+ years of industry experience in R&D and HVM environments. Prior experience in advanced packaging development of consumer electronic devices, CMOS imagers, MEMS products, Bio-Medical Devices or Microfluidic systems preferred.
  • Bachelor's degree in a scientific and/or engineering discipline. Advanced degree preferred.
  • Program Management experience is desired, including experience with project management tools, work break-down structure, and resource management.
  • Familiarity with development and lifecycle for assembled semiconductor devices, medical devices, life sciences labs or semiconductor capital equipment.
  • Familiarity with ISO 9001 & ISO 13485 QMS.
  • Familiarity with methods for design, process development and integration in one or more packaging related technologies including Silicon interposer (SI), Chip-Package Interaction (CPI), Lead free bump, Cu Pillar, wire-bonding, low temperature bonding and adhesive selection, high pin-count flip chip, injection molding plastics, Through Silicon Vias  (TSV), hermetic and wafer level packaging, bio-surface treatments, plastics, micro-fluidics etc.
  • Familiarity with strategies and methods for package qualification, functional testing and failure analysis in low and high-volume environments for consumer and medical applications.
  • Experience in simulation tools like SolidWorks and AutoCAD, 
  • Strong presentation, communication, and documentation skills.
  • Ability to travel up to 15% between manufacturing sites


All listed tasks and responsibilities are deemed as essential functions to this position; however, business conditions may require reasonable accommodations for additional tasks and responsibilities.
All qualified applicants will receive consideration for employment without regard to race, sex, color, religion, national origin, protected veteran status, or on the basis of disability, gender identity, and sexual orientation.

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