Engineer II, Device Packaging

The Process Development Group seeks a dedicated back end packaging engineer with experience in semiconductor packaging technologies to work on Device R&D. The individual will be required to participate in complex and multifunctional development projects requiring both initiative and a desire to learn about topics outside of conventional semiconductor assembly. The candidate will be expected to participate not only in hands-on activities, such as prototype design, development and fabrication, but also to interact with and provide direction to external vendors and be comfortable working with extended teams. The candidate must have an appetite for solving complex problems requiring evaluation of intangible factors and must be very comfortable in a multi-disciplinary environment.

Responsibilities:

• Collaborate with cross-functional groups including Manufacturing, Instrument R&D, Surface Chemistry and Semiconductor Design and Wafer Fabrication, to develop Packaging Solutions for PacBio's emerging technologies using such technologies as wafer-wafer bonding, dicing, grinding, TSV, die attach, wire bond, flip chip, SMT etc.
• Build chips using packaging equipment for die attach, wire bond etc. in a pilot line setting.
• Execute test plans on package sub-components and full chip assemblies to determine design and process window.
• Work with external vendors to identify and resolve issues and develop optimized assembly processes. This may involve visits and teleconferences with domestic and overseas partners.
• Prepare drawings and models of packages and components and develop prototypes.
• Prepare, execute and document specifications and Qualification Plans for new Package designs.
• Collaborate with R&D teams to analyze failures and determine root cause using such techniques as SEM, EDX, TEM and mechanical and reliability testing.

All listed tasks and responsibilities are deemed as essential functions to this position; however, business conditions may require reasonable accommodations for additional tasks and responsibilities.

Position Requirements:

• BA/BSc. or equivalent experience in Chemical Engineering, Materials Science, Electrical Engineering, Physics or related scientific and engineering disciplines. 2-5 years of industry experience in either a low volume development assembly house or high volume packaging facility and hands-on experience with assembly equipment, e.g., die attach, wire bond etc., preferred.
• Demonstrated experience in device packaging for one of the following areas, consumer electronic devices, CMOS imagers, MEMS products, Bio-Medical Devices, or Microfluidic systems.
• Familiarity with strategies and methods for package qualification, functional testing and failure analysis in low and high volume environments for consumer and medical applications.
• Proficient in CAD design tools such as SolidWorks or AutoCAD and in statistical analysis tools such as JMP or Minitab.
• Experience with failure analysis, DOE, SPC, FMEA and DFM.
• Excellent presentation, verbal and written communication skills.

All qualified applicants will receive consideration for employment without regard to race, sex, color, religion, national origin, protected veteran status, or on the basis of disability, gender identity, and sexual orientation.