StratEdge Features Packages for the Extreme Demands of GaN and GaAs Devices at IMS2018 in Booth 1649
StratEdge will showcase its complete line of post-fired and molded ceramic semiconductor packages operating from DC to 63+ GHz. These packages have electrical transition designs that ensure exceptionally low electrical losses and operate efficiently, even at the highest frequencies. All packages are lead-free and most meet RoHS and WEEE standards. In addition, StratEdge offers complete automated assembly and test services for these packages, including gold-tin solder die attach.
“IMS is the preeminent gathering of stakeholders in the field of RF, microwave, and millimeter-wave technologies,” said Tim Going, president of StratEdge. “5G and its high-power infrastructure, the Internet of Things, and advanced cellular technologies requiring RF and microwave frequencies will make package selection critical. IMS is a great opportunity for those involved to visit our booth and discuss their packaging requirements.”
StratEdge will be exhibiting in booth 1649, at IMS2018, on June 12–14 2018 at the Pennsylvania Convention Center, Philadelphia, Pennsylvania.
Photo available at: http://www.stratedge.com/stratedge-at-ims-2018.png
StratEdge designs and manufactures high-performance semiconductor packages and provides chip assembly and test services. We specialize in packages for high-frequency, very high power, extremely demanding gallium arsenide (GaAs) and gallium nitride (GaN) devices and have a complete line of post-fired and molded ceramic semiconductor packages that operate from DC to 63+ GHz. Our patented electrical transition designs give StratEdge packages exceptionally low electrical losses, even at 63+ GHz. Markets served include telecom, mixed signal, VSAT, broadband wireless, satellite, military, test and measurement, automotive, down-hole, and MEMS. StratEdge is an ISO 9001:2008 facility.
Source: StratEdge Corporation