NXP Semiconductors Showcases Base Station TRx Component Demonstrator for LTE / LTE Advanced Wireless Air Interface Standards at IMS 2011
Published: May 18, 2011
(Click here for details)
Image of NXP BTS TX2 Subsystem Demo Board: Digital-to-Analog Converter (DAC) and Analog-to-Digital Converter (ADC)
(Click here for details)
BTS RX2 Subsystem Board from NXP: Radio Frequency Small Signal component for receive line ups from LNAs to dual down mixers to IF VGAs and LO Synthesizers; Analog-to-Digital Converter
EINDHOVEN, NETHERLANDS--(Marketwire - May 18, 2011) -
NXP High Performance RF
NXP RF Infrastructure Design
- According to Cisco Visual Networking Index, global mobile data traffic will increase 26-fold between 2010 and 2015. Increasing mobile phone minutes and mobile data usage continues to transform and drive demand for wireless base transceiver stations.
- As the number of users and higher data usage requirements increase, higher capacity networks require the deployment of more BTS systems, resulting in more transmit and receive channels per BTS system and in increasing medium to small cell sizes. Cellular providers, municipalities across the globe, and wireless original equipment manufacturers (OEM) are pushing for higher system efficiencies. Next-generation BTS systems require and must leverage proven and innovative High Performance RF components to optimize cost, size and power efficiency.
Kees Schetters, director, wireless infrastructure, NXP Semiconductors, said, "This BTS radio component demonstrator will showcase NXP's unique set of technologies ranging from RF/IF amplifiers to frequency synthesizers and IQ modulators to RF modules based on NXP's proprietary QUBiC4 SiGe:C processes and industrial capabilities. This set of components finds its way in today's multi standard base station platforms, as well as repeaters and point-to-point systems supporting next generation communication standards like LTE Advanced.
LTE 4x Increased Spectral Efficiency, 10x Users Per Cell
3GPP: "Spectral efficiency is increased by up to four-fold compared with UTRA, and improvements in architecture and signalling reduce round-trip latency. Multiple Input / Multiple Output (MIMO) antenna technology should enable 10 times as many users per cell as 3GPP's original W CDMA radio access technology."
A global leader in RF technology and component design, NXP Semiconductors offers a broad portfolio of products from discrete to highly integrated devices in order to support next generation base station design. At IMS 2011, design engineers will have the opportunity to review the following fully functional BTS components:
- TX BTS Application Board
- Digital-to-Analog Converter (DAC) and Analog-to-Digital Converter (ADC)
- Radio Frequency Small Signal component for transmit line ups from quadrature modulators to MPAs to Tx VGAs and LO Synthesizers
- PA&FE Board
- RF Power device with industry-leading LDMOS technology
- RX BTS Application Board
- Radio Frequency Small Signal component for receive line ups from LNAs to dual down mixers to IF VGAs and LO Synthesizers
- Analog-to-Digital Converter (ADC)
- Benefits of NXP's base station technology
- Strong position in RF power transistors for base station power amplifiers
- Extensive portfolio of RF small signal components based on QUBIC4 BiCMOS
- Highly competitive data converter portfolio including JESD204A-compliant devices
- Enabling technology to support OEMs in future TRx radio design and partitioning.
- Video: NXP technology for wireless infrastructure
- NXP High Performance RF technology
- Mobile communication infrastructure design with NXP
Base Transceiver Station System, BTS, radio frequency, RF, RF Power, satellite base station, LTE, LTE Advanced, High Performance RF, IMS 2011, mixed signal, DAC, ADC, mobile data usage, wireless base transceiver stations, QUBiC4 SiGe:C, 3G, 4G, GSM, CDMA, LTE, LNA, VGA, MPA, LO Synthesizers, frequency synthesizers, quadrature modulators, repeaters, point-to-point, IQ modulators
About NXP HPRF
Shipping more than 4 billion RF products annually, NXP is a clear industry leader in High Performance RF. From satellite receivers, cellular base stations and broadcast transmitters to ISM (Industrial, Scientific, and Medical) and aerospace and defense applications. NXP is a leader in High Performance Mixed Signal IC products and the recognized leader in SERDES-based serial interfaces for high speed converters. NXP offers a broad selection of high-speed data converters, with digital interfaces including JESD204A compliant CGV, CMOS LVCMOS and LVDS DDR interfaces. These high speed converters are suitable for wireless infrastructure, industrial, scientific, medical, aerospace and defence applications.
About NXP Semiconductors
NXP Semiconductors N.V. (NASDAQ: NXPI) provides High Performance Mixed Signal and Standard Product solutions that leverage its leading RF, Analog, Power Management, Interface, Security and Digital Processing expertise. These innovations are used in a wide range of automotive, identification, wireless infrastructure, lighting, industrial, mobile, consumer and computing applications. A global semiconductor company with operations in more than 25 countries, NXP posted revenue of $4.4 billion in 2010. Additional information can be found by visiting www.nxp.com.
This document includes forward-looking statements which include statements regarding NXP's business strategy, financial condition, results of operations, and market data, as well as any other statements which are not historical facts. By their nature, forward-looking statements are subject to numerous factors, risks and uncertainties that could cause actual outcomes and results to be materially different from those projected. These factors, risks and uncertainties include the following: market demand and semiconductor industry conditions; the ability to successfully introduce new technologies and products; the end-market demand for the goods into which NPX's products are incorporated; the ability to generate sufficient cash, raise sufficient capital or refinance corporate debt at or before maturity; the ability to meet the combination of corporate debt service, research and development and capital investment requirements; the ability to accurately estimate demand and match manufacturing production capacity accordingly or obtain supplies from third-party producers; the access to production capacity from third-party outsourcing partners; any events that might affect third-party business partners or NXP's relationship with them; the ability to secure adequate and timely supply of equipment and materials from suppliers; the ability to avoid operational problems and product defects and, if such issues were to arise, to correct them quickly; the ability to form strategic partnerships and joint ventures and to successfully cooperate with alliance partners; the ability to win competitive bid selection processes to develop products for use in customers' equipment and products; the ability to successfully establish a brand identity; the ability to successfully hire and retain key management and senior product architects; and, the ability to maintain good relationships with our suppliers. In addition, this document contains information concerning the semiconductor industry and NXP's business segments generally, which is forward-looking in nature and is based on a variety of assumptions regarding the ways in which the semiconductor industry, NXP's market segments and product areas may develop. NXP has based these assumptions on information currently available, if any one or more of these assumptions turn out to be incorrect, actual market results may differ from those predicted. While NXP does not know what impact any such differences may have on its business, if there are such differences, its future results of operations and its financial condition could be materially adversely affected. Readers are cautioned not to place undue reliance on these forward-looking statements, which speak to results only as of the date the statements were made. Except for any ongoing obligation to disclose material information as required by the United States federal securities laws, NXP does not have any intention or obligation to publicly update or revise any forward-looking statements after we distribute this document, whether to reflect any future events or circumstances or otherwise. For a discussion of potential risks and uncertainties, please refer to the risk factors listed in our SEC filings. Copies of our SEC filings are available from on our Investor Relations website, www.nxp.com/investor or from the SEC website, www.sec.gov.