NXP Semiconductors Kicks Off High Performance RF Design Challenge

Published: Jan 10, 2011

Cartoon: NXP High Performance RF Design Challenge

EINDHOVEN, NETHERLANDS--(Marketwire - January 10, 2011) -

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NXP Semiconductors N.V. (NASDAQ: NXPI) has now opened registration for its first-ever High Performance RF Design Challenge, inviting RF engineers and students worldwide to submit creative application ideas for RF power devices. RF power transistors have traditionally been used in telecommunications, aerospace and broadcast infrastructure, as well as various industrial, scientific and medical applications. As RF LDMOS technology has become more powerful, rugged and cost-effective, this has in turn enabled exciting new applications such as RF-driven lamps. The NXP HPRF Design Challenge will award prizes to design entries based on criteria including creativity, design efficiency, usefulness, originality and proof of concept. Prizes worth $25,000 include an all-expenses-paid trip to the 2011 MTT-S International Microwave Symposium in Baltimore, Maryland, US.

Facts / Highlights:

The NXP High Performance RF Design Challenge will take place in three phases:
- Phase I: Conceptual Design - January 10, 2011 to February 20, 2011
- Phase II: Hardware Design - February 28, 2011 to April 24, 2011
- Phase III: Prototype - May 2, 2011 to May 29, 2011
The Conceptual Design Phase requires an initial design, including an abstract, title and block diagram. Contestants receive a free HPRF Design Challenge kit once a valid entry has been submitted.
During the Hardware Design Phase, each contestant will develop and provide a proof of concept of a working prototype -- for example, as a video or as a measurement report -- as well as an accompanying bill-of-materials, schematics, layout file and other design-related material.
A group of finalists from EMEA, Asia Pacific and the Americas will enter the Final Prototype Phase, during which each contestant will be given an opportunity to polish his or her design in a regional NXP HPRF design lab, with transportation and accommodation costs covered by NXP.
The top three finalists will have an all-expenses-paid trip to IMS2011. The Grand Prize will include a $3,000 Apple Store® voucher.
Registered Design Challenge Community members will also be eligible to rate and vote on design entries, alongside a panel of judges from NXP.

Supporting Quotes:

"High Performance RF technologies have traditionally been used to solve the toughest engineering challenges, in applications ranging from satellite receivers, wireless base stations and broadcast transmitters, to ISM, aerospace and defense. The goal of our HPRF Design Challenge is to inspire talented RF engineers to think creatively and bring RF power to new and interesting application areas. In other words: Be daring. Surprise us! And we'll support you in bringing your concepts to life," said John Croteau, senior vice president and general manager, high performance RF and power lighting solutions, NXP Semiconductors.

Links

NXP High Performance RF Design Challenge
Cartoon: NXP HPRF Design Challenge
Follow up-to-the-minute developments via Twitter: @NXP_HPRF_Scott

About NXP Semiconductors
NXP Semiconductors N.V. (NASDAQ: NXPI) provides High Performance Mixed Signal and Standard Product solutions that leverage its leading RF, Analog, Power Management, Interface, Security and Digital Processing expertise. These innovations are used in a wide range of automotive, identification, wireless infrastructure, lighting, industrial, mobile, consumer and computing applications. Headquartered in Europe, the company has approximately 28,000 employees working in more than 25 countries and posted revenue of US$ 3.8 billion in 2009. For more information, visit www.nxp.com

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