FEI Company Helios 1200AT DualBeam System Accelerates Process Development and Ram

Published: Jun 06, 2013

Staying up-to-date has never been simpler. Sign up for the free GenePool newsletter today!

HILLSBORO, Ore., June 6, 2013 (GLOBE NEWSWIRE) -- FEI (Nasdaq:FEIC) today released the Helios NanoLabâ„¢ 1200AT, the newest generation of its full-wafer DualBeamâ„¢ analysis systems. The addition of an optional automated FOUP (front opening universal pod) loader allows location of the Helios NanoLab 1200AT system inside the semiconductor wafer fab, where its scanning electron microscope (SEM) imaging and precise focused ion beam (FIB) milling are used by engineers to extract ultrathin samples of targeted structures and defects for examination in a high-resolution transmission electron microscope (TEM).

Help employers find you! Check out all the jobs and post your resume.

Back to news