12/27/2013 8:49:25 AM
Wellesley, Mass (PRWEB) December 27, 2013 -- According to a new technical market research report Flip Chip Technologies and Global Markets from BCC Research (http://www.bccresearch.com) the global market for flip chip technology was valued at $18.9 billion in 2012 and is expected to increase to $20.1 billion in 2013. BCC Research projects the market to grow to nearly $36.5 billion by 2018, and register a five-year compound annual growth rate of 12.7% from 2013 to 2018.
Flip chip technology has enabled electronics technology to reach new levels of performance, while fueling the growth of global markets for semiconductors, electronic devices and a host of industrial and consumer products. In recent years, the growth of flip chip interconnect technology over other interconnect technologies has been remarkable because of the increasing complexity of the architecture of chip design and fabrication.
Flip chip technology is used to interconnect semiconductor devices, such as integrated circuits (ICs), to external circuitry by means of solder bumps that have been deposited onto chip pads. Traditionally, semiconductor devices use wire bonds to connect devices from substrates or other active components. Due to the shrinking size of chips and demand for more sophisticated structures, demand for flip chips with controlled collapse chip connection (C4) technology has grown significantly. Features such as improved thermal heat transfer and improved performance at higher frequencies have also driven the market for flip chips.
Various wafer bumping technologies, such as tin-lead (Sn-Pb) and gold stud bumping, are used extensively in flip chip bumping and account for the major share of the market. However, government regulations and the high cost of the materials used in these processes are expected to result in them being replaced by copper (Cu) pillar bumping, as it is a high-performance, low-cost, and nontoxic process. In terms of applications of Cu pillar bumping, communication devices and other computing devices are expected to drive the market in the near term.
Severe warpage of a substrate after the flip chip assembly process may lead to fracture of solder joints, underfill delamination or underfill cracks, decreasing the lifespan of chips. Recent work has shown that the unstable contact resistance of electrically conductive adhesives on copper and tin is due to electrochemical corrosion of these metals under elevated temperature and humidity conditions. Technological advancements include a new class of conductive adhesives that exhibit exceptional contact resistance stability on surfaces including organic solderability preservative (OSP) copper, Sn alloys and even 100% Sn. Advancements such as this have reduced lead times. Demand for flip chips in applications such as the CMOS 28 nm IC and new applications such as application processor engines, base band modules, double data rate memory and the 3DIC/2.5D interposer, using micro bumping, is expected to increase in the near future.
LA JOLLA, Calif., Dec. 23, 2013 /PRNewswire/ -- Regulus Therapeutics Inc. (NASDAQ:RGLS), a biopharmaceutical company leading the discovery and development of innovative medicines targeting microRNAs, today announced that it has been selected for addition to the NASDAQ Biotechnology Index effective prior to the market open on Monday, December 23, 2013.
The NASDAQ Biotechnology Index is designed to track the performance of a set of securities listed on the NASDAQ Stock Market® that are classified as either biotechnology or pharmaceutical according to the Industry Classification Benchmark (ICB), which also meet other eligibility criteria. To be eligible for inclusion on this Index, companies must, among other things, initially have a minimum market capitalization of $200 million and a minimum average daily trading volume of 100,000 shares. The securities on this Index are evaluated semi-annually and serve as the basis for the iShares NASDAQ Biotechnology Index Fund (NASDAQ: IBB). For more information about the NASDAQ Biotechnology Index, please visit www.nasdaq.com.
Regulus Therapeutics Inc. (NASDAQ:RGLS) is a biopharmaceutical company leading the discovery and development of innovative medicines targeting microRNAs. Regulus is uniquely positioned to leverage a mature therapeutic platform that harnesses the oligonucleotide drug discovery and development expertise of Alnylam Pharmaceuticals, Inc. and Isis Pharmaceuticals, Inc., which founded the company. Regulus has a well-balanced microRNA therapeutic pipeline entering clinical development, an emerging microRNA biomarkers platform to support its therapeutic programs, and a rich intellectual property estate to retain its leadership in the microRNA field. Regulus intends to focus its proprietary efforts on developing microRNA therapeutics for oncology indications and orphan diseases and is currently advancing several programs toward clinical development in oncology, fibrosis and metabolic diseases. Regulus is also developing RG-101, a GalNAc-conjugated anti-miR targeting microRNA-122, for the treatment of chronic hepatitis C virus infection. Regulus' commitment to innovation and its leadership in the microRNA field have enabled the formation of strategic alliances with AstraZeneca, GlaxoSmithKline and Sanofi. In addition, Regulus has formed a research collaboration with Biogen Idec around its emerging microRNA biomarkers platform.
For more information, please visit http://www.regulusrx.com.
Statements contained in this press release regarding matters that are not historical facts are "forward-looking statements" within the meaning of the Private Securities Litigation Reform Act of 1995, including statements associated with Regulus' expectations regarding future therapeutic and commercial potential of Regulus' business plans, technologies and intellectual property related to microRNA therapeutics being discovered and developed by Regulus. Because such statements are subject to risks and uncertainties, actual results may differ materially from those expressed or implied by such forward-looking statements. Words such as "believes," "anticipates," "plans," "expects," "intends," "will," "goal," "potential" and similar expressions are intended to identify forward-looking statements. These forward-looking statements are based upon Regulus' current expectations and involve assumptions that may never materialize or may prove to be incorrect. Actual results and the timing of events could differ materially from those anticipated in such forward-looking statements as a result of various risks and uncertainties, which include, without limitation, risks associated with the process of discovering, developing and commercializing drugs that are safe and effective for use as human therapeutics, and in the endeavor of building a business around such drugs. These and other risks concerning Regulus' programs are described in additional detail in Regulus' SEC filings. All forward-looking statements contained in this press release speak only as of the date on which they were made. Regulus undertakes no obligation to update such statements to reflect events that occur or circumstances that exist after the date on which they were made.
Director, Investor Relations and Corporate Communications
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