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FEI Company Announces New ExSolve High-Throughput TEM Sample Preparation Workflow  
10/30/2013 8:21:53 AM

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HILLSBORO, Ore., Oct. 29, 2013 (GLOBE NEWSWIRE) -- FEI (Nasdaq:FEIC) today released ExSolve™, an automated, high-throughput sample preparation workflow for transmission electron microscopy (TEM) analysis. The ExSolve wafer TEM prep (WTP) dramatically reduces the cost and increases the speed of sample preparation, providing semiconductor and data storage manufacturers with quick and easy access to the data they need to verify and monitor process performance. ExSolve can prepare site-specific TEM lamella, sampling many sites per wafer in a fully-automated process inside the fab, giving semiconductor manufacturers much more information than conventional approaches, while at the same time reducing the capital cost of sample preparation by up to 70 percent.

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