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CEA-Leti and Docea Power to Combine Expertise on 3D Integration, Thermal and Low-Power Design


6/14/2010 8:28:37 AM

GRENOBLE, France & ANAHEIM, Calif.--(BUSINESS WIRE)--CEA-Leti and Docea Power announced today that they will combine their expertise in 3D silicon integration and thermal and low-power design. Under the terms of the common laboratory agreement, CEA-Leti will use EDA tools provided by Docea Power to build 3D-IC designs and methodologies for developing advanced applications consumer and wireless. CEA-Leti is the leading global research center committed to creating innovation in micro- and nanotechnologies. Docea Power, the design-for-low-power company, delivers software for power and thermal analysis at the architectural level.

Read at BioSpace.com

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