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3-D Self-Assembling Structures Could Lead to New Microchips, Other Devices, Massachusetts Institute of Technology (MIT) Study


6/8/2012 7:31:05 AM

Researchers at MIT have found a new way of making complex three-dimensional structures using self-assembling polymer materials that form tiny wires and junctions. The work has the potential to usher in a new generation of microchips and other devices made up of submicroscopic features.


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